Ultrasonic Spraying of Photoresist onto Silicon Wafer
Ultrasonic spraying of photoresist onto silicon wafer may seem simple, but in fact it contains complex scientific principles.
Ultrasonic spraying of photoresist is a technology widely used in semiconductor manufacturing. It sprays photoresist on silicon wafers to form fine patterns, laying the foundation for the subsequent manufacturing process. Photoresist is an organic compound, mainly composed of photosensitive resin, sensitizer and solvent. It undergoes chemical changes after exposure to ultraviolet light and is a key material for micro-pattern processing on silicon wafers. However, the use of photoresist requires the use of photolithography machines and other equipment to achieve the process of mapping graphics onto silicon wafers. The photolithography machine is the core equipment for manufacturing chips. It uses light to map the pattern on the mask onto the silicon wafer. During the photolithography process, the photolithography machine needs to work on the silicon wafer that has been coated with photoresist. Although it seems simple, the technology of ultrasonic spraying of photoresist requires extremely high operating precision and equipment. Only engineers with professional training and advanced equipment can do it.
Today, with the rapid development of science and technology, the technology of ultrasonic spraying photoresist on silicon wafer will drive more technological developments. Let us look forward to more technological breakthroughs!
About Cheersonic
Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.
Our coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.
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