Ultrasonic Spray Photoresist Coating

Cheersonic’s Ultrasonic Spray Photoresist Coating System has proven to be suitable for a variety of applications, including photoresist or polyimide film coatings. By controlling thicknesses from submicron to over 100 microns and capable of coating any shape or size, Cheersonic’s coating system is an alternative to other coating technologies such as spinning and conventional spraying.

Common applications for photoresist and polyimide coatings include MEMS, lenses, microfluidic devices, microelectronics, and filters. Cheersonic’s coating system can be applied to flat and 3D substrates, usually including silicon wafers, glass, ceramics and metals.

Ultrasonic spraying is a simple, economical and repeatable process for photoresist and polyimide coating. Cheersonic’s ultrasonic coating system uses precise delamination technology to precisely control flow rate, coating speed and deposition. Low-speed spray molding defines atomized spray as an accurate, controllable pattern that avoids overspray while producing a very thin uniform layer.

Advantages of ultrasonic nozzle photoresists and polyimides include:

Uniform film coverage of various surface parts.
High flexibility.
No clogging atomized spray.
The transfer efficiency is high and the waste is extremely low.
A highly repeatable, mature spray process.

Ultrasonic Spray Photoresist Coating Video