Ultrasonic Photoresist Coater

Ultrasonic Photoresist Coater – Spraying Photoresist For MEMS Wafers

The ultrasonic spray coating machine UAM6000 combines new spray and control technology to achieve more uniform, denser and controllable thin film coating. The equipment integrates multiple systems, such as ultrasonic, carrier gas, heating plate, vacuum adsorption and exhaust gas discharge. At the same time, it can be applied to a full range of ultrasonic nozzles, suitable for medium area and large-scale production type film preparation. UAM6000 has been widely for spraying photoresist for MEMS wafers and other substrates with varying topographies.

Ultrasonic Photoresist Coater - Spraying Photoresist For MEMS Wafers

⚫ The Adhesion promoter and the photoresist should be coated by the ultrasonic nozzle. The precise control of the liquid inlet system and the reasonably designed spraying method combine to spray the substrate evenly and efficiently.
⚫ Start the heating function which is convenient for subsequent spraying.
⚫ Load the liquid into the inlet system and introduce it into the ultrasonic nozzle, and use the ultrasonic injection pump to check the nozzle’s working condition.
⚫ Select the experimental spraying method and spraying parameters on the touch screen to spray

Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.