Spray EMI

Ultrasonic spraying technology provides a cost effective and efficient spraying method for the package level EMI shielding process. For EMI applications, Cheersonic has developed a special ultrasonic nozzle configuration to provide a more targeted spray area that can greatly reduce overspray.

As traditional spraying methods, electroplating and sputtering not only increase the cost, but the throughput is also moderate. The high density silver paste provides excellent EMI shielding characteristics for packagelevel shielding. It can be used with Cheersonic’s ultrasonic spray equipment. Cheersonic can customize high-volume in-line conveyor configuration for customers.

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