Project Description
CS55-X100 Ultrasonic Soldering Iron System
Ultrasonic Soldering Iron System is a fluxless process, utiizing acoustically driven mechanical engery to fracture and disrupt oxide films on solder and base materials to promote solder wetting and and adherence. Flux can contaminate and damage/corrode senstive materias, so fluxless soldering is advantageous.
Ultrasonic soldering provides the ability to join most any metal to any other metal, such as a tungsten wire to a stainless steel leadframe, or a copper wire to a nickel tab. Joints will be limited in operating temperature based on the particular solder used. However, all solders can be used with ultrasonic soldering, including lead-free and zinc-based solders.
APPLICABLE INDUSTRIES
ENERGY
- FUEL CELL
- THIN FILM SOLAR CELL
- SILICON SOLAR CELL
ELECTRONICS
- SPRAY FLUX
- SEMICONDUCTOR
- TOUCH SCREEN
Features
• ECO friendly soldering solution: Flux and flux-cleaning process are not needed.
• Perfect Soldering: No Flux Soldering, highly Solid and Reliable Soldering Joint
• Production Cost Savings & High Productivity
• Support of New Application Development: Applying to Solar Cell Glass, Semiconductor, Ceramic Heater, Soldering of Dissimilar Materials (Al-Cu, Al-Glass, Al-Ceramic)
Basic Specifications
• Frequency: 55KHz
• Output power: 100 Watt
• Max amplitude: 8μm
• Operation panel: working temperature, power adjust switch
• Max temperature: 500℃
• Display: amplitude, power, set temperature, current temperature
