Project Description

CS40-X80 ULTRASONIC SOLDERING IRON MACHINE

Ultrasonic Soldering Iron Machine a variant of traditional iron soldering, where instead of requiring a flux to chemically reduce the metals’ surface oxides, the ultrasonic vibration from the soldering iron produces cavitation bubbles in the liquid solder. When the cavitation bubbles collapse, the mechanical motion of the collapse abrasively removes the surface oxides from the metal to be soldered. Once this occurs, the liquid solder can bond to the metal substrate. In both cases, the soldering iron tips are heated and keep the solder liquid or molten on the tip.

Advantages of ultrasonic soldering include the cost savings in flux and post-solder flux removal operations, no fumes, and the ability to solder to difficult-to-wet metals. This last advantage provides design engineers with many more options for electronic components. Most metals need to be plated with nickel, tin, or both to provide a “solderable” surface. Metal plating is not a “green” process and is often a source of quality issues downstream in the manufacturing plant.

APPLICABLE INDUSTRIES

ENERGY

  • FUEL CELL
  • THIN FILM SOLAR CELL
  • SILICON SOLAR CELL

ELECTRONICS

  • SPRAY FLUX
  • SEMICONDUCTOR
  • TOUCH SCREEN

Features

• ECO friendly soldering solution: Flux and flux-cleaning process are not needed.
• Perfect Soldering: No Flux Soldering, highly Solid and Reliable Soldering Joint
• Production Cost Savings & High Productivity
• Support of New Application Development: Applying to Solar Cell Glass, Semiconductor, Ceramic Heater, Soldering of Dissimilar Materials (Al-Cu, Al-Glass, Al-Ceramic)

Basic Specifications

• Frequency: 40KHz±5KHz
• Output power: 80 Watt
• Power: AC100V / 240V，50 / 60Hz，150W
• Operation panel: working temperature, power adjust switch
• Max temperature: 500℃
• Display: amplitude, power, set temperature, current temperature