Photoresist Spray Coat

Made commercially available in the early 2000, spray coating has many advantages. MEMS Devices are often designed with high aspect ratio features making it difficult to achieve conformal photoresist coverage using the standard spin coat method. Spray coat technology allows you to coat topographies ranging from a few microns to a few hundred microns making it an ideal for fabricating 3D features, like V-grooves, deep trenches, silicon cavities and through-silicon vias.

Our photoresist spray coat process is a great alternative to spin coat and can be adapted to meet your specific needs. In addition to integrating this unique capability into our MEMS fabrication modules, we also provide spray coat as a stand alone process.

Spray Coat Unique Capabilities

Enabling technology for patterning across severe topography
Conformal coating with top edge coverage while avoiding resists accumulation in trenches
Proprietary spray design for optimal process stability and reproducibility