Photoresist Spray Using Ultrasonics
Photoresist Spray Using Ultrasonics. Improvement of Photoresist Film Coverage on High Topology Surface with Spray Coating Technique
The direct ultrasonic spray system includes an ultrasonic spray nozzle, which generates a distribution of droplets of micrometer size. During spray coating, the wafer is rotated slowly while the swivel arm of the spray coating unit is moved across the wafer. The low spinning speed (30-60 rpm) is to minimize the centrifugal force. The rotation also allows resist coverage in all angles of the cavities. Because the parts are static, no residual stresses in the coating are encountered as in spinning and the meniscus problem is significantly reduced.
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