Photoresist Spray Coating

The photoresist spray coating system uses ultrasonic nozzle technology.

Instead of traditional spin coating equipment, UAM4000L is designed for photoresist coating of wafers with high aspect ratio and deep hole topography (such as MEMS wafers). The system is usually equipped with UAC series or UAL series ultrasonic spray forming nozzles as required. UAM4000L is specially designed for 100, 150, 200 and 300mm wafers, providing automatic spraying with multi-spray storage, precise temperature control and integrated wafer locking.

The new photoresist coating system UAM4000L is specifically designed for photoresist coating of wafers with high aspect ratio and deep hole topography (such as MEMS wafers).

UAM4000L replaces traditional spin coating equipment and provides more uniform sidewall coverage in difficult-to-coat applications. Ultrasonic spray has been used for photoresist deposition for many years and is an effective method for semiconductor lithography manufacturing.

According to coating requirements, UAM4000L is usually equipped with UAC series or UAL series ultrasonic nozzles. Cheersonic’s application engineer team can ensure that each process is correctly configured. The core of the system is Cheersonic’s patented ultrasonic nozzle technology. The material consumption of all ultrasonic nozzles is reduced by 95%, non-clogging performance, and precise target spraying patterns are achieved with ultra-low flow.

The unique system functions of UAM4000L include:
• With memory function, automatic spraying
• Designed for 100, 150, 200 and 300mm wafers
• Precise temperature control
• Integrated wafer locking
• Highly repeatable syringe pump with automatic filling function
• Manual wafer loading/unloading
• Highly repeatable and stable process

Cheersonic has extensive application expertise in the deposition of photoresist on MEMS and other semiconductor wafer substrates.