Ultrasonic Spraying for Coating Polyimide on Wafer Chuck
What is the process of ultrasonic spraying for coating polyimide on wafer chuck?
Ultrasonic spraying technology uses ultrasonic atomization technology to disperse liquid into small particles, forming particles ranging in size from several micrometers to 100 micrometers, and is widely used in the spraying field. The field of electronic semiconductors is one of the typical applications of ultrasonic spraying. Polyimide coating is applied on wafer chucks to improve production efficiency. Wafer chucks are used to support and fix wafers for making semiconductor devices on them.
Polyimide, as a high-performance engineering plastic, has excellent properties such as high temperature resistance, corrosion resistance, and fatigue resistance, and is widely used in the semiconductor industry. In order to improve the performance and reliability of semiconductor devices, it is necessary to coat the wafer chuck with polyimide coating. Ultrasonic spraying technology is an effective coating method. This technology has the advantages of controllable droplet size, adjustable liquid flow rate, and variable spray mode, which can meet the needs of various types of coatings.
The application of ultrasonic spraying technology not only injects new impetus into the development of the semiconductor industry, but also shows us the infinite possibilities of technology changing the future.
About Cheersonic
Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.
Our coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.
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