Ultrasonic-assisted Soldering System

Development of an open-source ultrasonic-assisted soldering system

A modular ultrasonic-assisted soldering platform is designed to provide precise control over process parameters. Translational and rotational motion control of the solder tip allows for leading-edge soldering.

A solder wire extruder is implemented to precisely control the volume of solder deposited on the substrate. A low-cost profilometer is integrated into the system to quantify the solder wetting behavior. Preliminary experiments which characterize the solder bead geometry demonstrate a high-degree of process repeatability.