Project Description

CS55-X100I ULTRASONIC SOLDERING IRON

Ultrasonic Soldering Iron makes it possible to solder glass, ceramics and low-solderability metals, such as Al, Mo, stainless steel etc. This is an ultrasonic soldering device that produces high quality soldered joints. The soldering iron consists of a high performance sheath heater and transducer, supplying heat and ultrasonic oscillations to the tip. Using solder alloy, you can easily solder directly to metals, semiconductors, glass and ceramic substrates and other low solderability materials, such as Al, Mo, or stainless steel.

This superior bonding technique provides an excellent airtight, weatherproof, humidity resistant seal as well as joints with good electroconductivity between interconnected layers.

APPLICABLE INDUSTRIES

ENERGY

  • FUEL CELL
  • THIN FILM SOLAR CELL
  • SILICON SOLAR CELL

ELECTRONICS

  • SPRAY FLUX
  • SEMICONDUCTOR
  • TOUCH SCREEN

Features

• ECO friendly soldering solution: Flux and flux-cleaning process are not needed.
• Perfect Soldering: No Flux Soldering, highly Solid and Reliable Soldering Joint
• Production Cost Savings & High Productivity
• Support of New Application Development: Applying to Solar Cell Glass, Semiconductor, Ceramic Heater, Soldering of Dissimilar Materials (Al-Cu, Al-Glass, Al-Ceramic)

Basic Specifications

• Frequency: 55KHz
• Output power: 100 Watt
• Max amplitude: 8μm
• Operation panel: working temperature, power adjust switch
• Max temperature: 450℃
• Display: temperature, current